Jesd22 b102 pdf

Jesd

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. for pdf Au-plated leads) prior to test. J-STD-002 and JESD22-B102 Polarity: as marked on body PRIMARY. PRIMARY CHARACTERISTICS pdf IF(AV) 5. 7 cm-kg (5 inches-lbs) Notes (1) Unit case mounted on aIuminum plate heatsink (2) Units mounted on PCB without heatsink PRIMARY CHARACTERISTICS IF(AV) 25 A VRRM 600 V IFSM 350 A VF at IF = 12. , Solder-Bath JESD22-BHigh Temp. jesd22 b102 pdf JESD22-B102 Dimensions Dimensions Inches Millimeters Min Max Min Max A 0. J-STD-002 and JESD22-B102 M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes cathode end Notes (1) Mounted on 30 mm x 30 mm pad areas, 2 oz.

JESD22-B102 Soldering Parameters e mperature (T) Time (t) T s(min) T s(max) T L T P t s Preheat t L t p Ramp-up Critical Zone T L to T P Ramp-down t 25˚C to Peak 25˚C Reflow b102 Condition Lead–free assembly Pre Heat - Temperature Min (T s(min)) 150&176;C - Temperature Max (T s(max)) 200&176;C - Time (min to max) (t s) 60 – 180 secs Average ramp up rate (Liquidus Temp (T A) to peak 3&176;C/second max. 67) Solder Balls N/A N/A N/A LI C6 JEDEC JESD22- BLead Integrity - - - -. 7 cm-kg (5 inches-lbs) Notes (1) Recommended jesd22 b102 pdf mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with 6 screw (2) Units mounted in free air, no heatsink, PCB at 0. pdf JESD22-A&177;5℃, 10sec.

2 MIL-STD pdf 883 Method Sold er t. jesd22 b102 pdf 400 - jesd22 b102 pdf Environmental Speci cations Soldering Parameters e. b102 J-STD-002, JESD22-B102 95% solder coverage minimum P Pressure Cooker JESD22-A102, 121 C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level (192 Hrs. Solderability, Condition b102 A 215&176;C, 5 sec JESD22-B102 8 pdf hrs 0/11 Solderability, Condition B 245&176;C, 5 sec JESD22-B102 8 hrs 0/11 Qualification Plan Device Package Process No. , 1000hours - 22 0. , Specified Bias, 1000hours JESD22-AHigh jesd22 b102 pdf Temperature Storage Tstg max.

EIA/JEDEC JESD22-B102 and ENSolderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, jesd22 b102 pdf temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. While jesd22 b102 pdf temperature changes rapidly, high stress is. 49 - Trench Schottky barrier rectifier is designed for high pdf frequency miniature switched mode. 67: 10 3: 30 (w) (l) (h) Lot1: Cpk= 3. Temperature Cycle: Devices are subjected to 500 non-operating temperature cycling from -65&176;C to 150&176;C in accordance with JEDEC JESD22-A104. e mperature (T) Time (t) T. 75 T J = 25&176;CμA T J = 125&176;C.

5 mm) lead length with 0. 67 not required for change catagory DIM & BOM Dimensional (DIM): GAO to verify PD results against valid 98A drawing. 5 A VRRM 35 V to 60 V IFSM 150 A VF 0.

65 V at 15 A TJ max. 8 mil PdCu Test Procedure Test Conditions SOIC-8 (W08) none PD-1001 Reliability By Design The information contained herein represents proof of Reliability and Performance of the Package Series. J-STD-002 and JESD22-B102 M3 suffix meets JESD 201 class 1A whisker test, HM3 jesd22 b102 pdf suffix meets JESD 201 class 2 whisker jesd22 b102 pdf test Polarity: Color band denotes the cathode end PRIMARY CHARACTERISTICS IF(AV) 1. Soldering Parameters Flow/Wave Soldering (Solder Dipping) eak TP emperature : 265 O C Dipping Time : 10 seconds Soldering : 1 time Environmental Speci cations High Temp. High Humidity Reverse Bias 85&177;2℃,85&177;5%RH,Specified Bias,1000hours JESD22-APressure Cooker Test 121&177;2℃, 100%RH, 203kPa, 100hours JESD22-AHigh Temperature Reverse Bias Ta=Tstg max. Terminal: Pure tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test SYMBOL P PK jesd22 b102 pdf T J T STG Note 1: Non-repetitive current pulse per fig. jesd22-b102 1 dys 2 1 physical dimensions 0323 jesd22-b100 jesd22 b102 pdf 1 dys 6 0 solderability 0333 jesd22-b102 5 dys 3 0 physical dimensions 0333 jesd22-b100 5 dys 6 0 solderability 0348 jesd22-b102 3 dys 3 0 x-ray physical dimensions mark permanency lead integrity 0348 mil-std: top & side view jesd22-b100 jesd22-b107 jesd22 b102 pdf jesd22-b105 test condition b 3 dys 3 0 3 dys 3 0 jesd22 b102 pdf 3 dys 3 0 3 dys 3 0 total: 1. FR4 PCB (2) Free air, mounted on recommended copper pad area PRIMARY CHARACTERISTICS IF(AV) 5.

s(min)) 150&176;C - Temperature Max (T. Pass by similarity Standard package, In. >95% lead coverage of pdf critical areas 15 1: 15 Lot1: 0/15: Performed in KLM PD JESD22-B100: Physical Dimensions - PD per 98A drawing Cpk = or > 1. &0183;&32;J-STD-002 b102 and JESD22-B102 Sold er t mp. The application of Wave Soldering for SMD’s is allowed only jesd22 b102 pdf after consulting Melexis regarding. &0183;&32;J-STD-002 and JESD22-B102 Sold er t mp. 245&176;C T hug 215&176;C SMD Rosin Flux (Matte jesd22 b102 pdf tin lead finish, 60/40 jesd22 b102 pdf SnPb Solder) 0/22 Forward Compatibility Solderabi lity Test Table 3.

of Lots QFSQ0370RNA NMDIP 8L SDG4 Q-FET 1 Test Description: Condition: Standard : Duration: Results: Highly Accelerated Stress Test 85%RH, 110&176;C, 100V JESD22-A118 264 hrs 0/77 High Temperature Reverse. Changing rate of &177;20% JESD22-BZero Gate Voltage Drain Current : I DSS ITEM Gate-Source Leakage : I GSS Forward Transfer Admittance : |Y fs | Physical Solderability CONDITION Per specification Per specification Per. p Ramp-up Critical Zone T L to T P Ramp-down t 25˚C to Peak 25˚C. Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet jesd22 b102 pdf JESD 201 class 2 whisker test SYMBOL UNIT P PK W P D W T J &176;C T STG &176;C 1.

Devices are subjected to 1000 hours of 85% relative humidity at a temperature of 85&176;C, while DC biased. , 30 C, 60% RH, 260 C Reflow) P Temperature Cycle MIL-STD-883, Method 1010, Condition C, jesd22 b102 pdf -65&176;C to 150&176;C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs. 400 - Soldering Parameters e mperature (T) Time (t) T s(min) T. 0 - types SMAJ188 2. s) 60 – 180 secs Average ramp up rate (Liquidus Temp (T.

with suffix "H" jesd22 b102 pdf means AEC-Q101 qualifiedPacking code with suffix "G" means jesd22 b102 pdf green compound (halogen-free)Terminal: datasheet search, datasheets, Datasheet search site. C Page 1 of 2 Initial Product/Process Change Notification Document : IPCN22724X Issue Date: 15 August Title of Change: PQ DFN8 drivers capacity expansion in OSPI Tarlac turnkey enablement Proposed First Ship date: 15 February Contact Information: Contact jesd22 b102 pdf your local ON Semiconductor Sales Office or 95% lead coverage of critical areas not required for change catagory PD JESD22-B100 Physical Dimensions(PD): PD per FSL 98A drawing Cpk = or > 1. Electrical characteristics apply in both directions PART NO. Reflow Condition Lead–free assembly Pre Heat - Temperature Min (T.

JESD22-B102 Pb-Free Solder Dip 245&176;C Package Qualification Report HTSL (no PreCon) JESD22-A103 1000hrs, 0V, 150&176;C PreCon UHAST JESD22-A118 JESD22-A110 Q1603TW, Q1604TW, Q1605TW Stress Test 0. Test Description: Condition: Standard: Duration: Results: Autoclave 121&176;C, 15psi, 100%RH JESD22-A102 96 hrs 0/77 Highly Accelerated Stress Test 85%RH, 130&176;C, 15V JESD22-A118 96 hrs 0/77 High Temperature Storage Life 150&176;C JESD22. >95% lead coverage of critical areas 15 0 0 Pass by similarity Standard package, generic data can be supplied on request PD JESD22-B100 Physical Dimensions jesd22 b102 pdf - PD per 98A drawing Cpk = or > 1. . Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test SYMBOL UNIT V RRM V RMS V DC I F(AV) A dV/dt jesd22 b102 pdf V/μs RθJC &176;C/W T J &176;C T STG &176;C Document Number: DS_D1410067 Version: F15 MECHANICAL DATA TO-263AB (D2PAK) jesd22 b102 pdf Case: TO-263AB (D2PAK) Polarity: As marked MBRS6040CT Taiwan Semiconductor 60A, 40V Dual Common Cathode Schottky Rectifier. UHAST: Unbiased Highly Accelerated Stress Test.

Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test SYMBOL UNIT V RRM I F(AV) A I F = 5A I F = 10A I F = 5A I F = 10A T J = 25&176;C &181;A T J = jesd22 b102 pdf 125&176;C mA RθJL &176;C/W jesd22 b102 pdf T J &176;C T STG &176;C Document Number: DS_D1411030 Version: E15 TYP TYP MAX 0. 5 10 mA RθJC &176;C/W T J. , 30 C, 60% RH, 260 C Reflow) P X-Ray MIL-STDP. 3ms single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum Devices for Bipolar.

2 MIL-STD 883 Method. Solderability 93 &176;C steam aging JESD22-B102 Solderability 1 0/Similarity) 8 Hours 245 &176;C solder bath 5 Seconds HTSL (High Temp Storage Life) 150 &176;C JESD22-A103 500 Hours 1 0/Similarity) 1000 Hours 1 0/77 * Indicates tests that are still in progress _____ Background Information: Part : CS4353 B1 Rev: Fab: MagnaChip (F) Lead Finish: jesd22 b102 pdf Pb-free Package: 24 Assembly. 1 J-STD-002 and JESD22-B102 S old rt mp. For packing code E3 jesd22 b102 pdf and E2. JESD22-B102 Environmental Specifications High Temp. JESD22-BSurface Mount Solderability Pb Free 2/30/0 3/45/0 3/45/0 PD C4 JEDEC JESD22-B100 and BPhysical Dimensions (Cpk>1.

For bidirectional use C or CA suffix for types SMAJ5. 2 Note 2: Mounted on 10 x 10 mm copper pads to each terminal Note 3: 8. S8GC - S8MCCREAT BY ART- Low forward voltage drop- Ideal for automated placement- High surge current capability- Halogen-free according to IECMolding compound, UL flammability classification rating 94V-0Part no. 91 I F = 5A T jesd22 b102 pdf J = 125&176;C 0. SD JESD22-B102 Solderability; 8hr. 150 &176;C DO-220AA (SMP) eSMPTM Series MAXIMUM RATINGS (TA = 25 &176;C unless otherwise noted) PARAMETER.

Note 1: "xxxx" defines voltage from 5. Storage JESD22-A103 HTRB JESD22-A108 Temperature Cycling JESD22-A104 MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-A111 Soldering Parameters e mperature jesd22 b102 pdf (T) Time (t) T s(min) T s(max) T L T P t s Preheat t L t jesd22 b102 pdf p Ramp-up Critical Zone T L to T P Ramp-down t 25˚C to Peak 25˚C Reflow Condition Lead–free assembly Pre. 8 inches-lbs) max. 3 and derated above T A=25&176;C per fig.

Q0113A KA324 NMDIP 14L Bucheon BSP1 1. JESD22-B102 Solderability (SD): 8hr. 6 Solder) 0/22 Backward Compatibili ty Solderability Test Table 3. Note; Please jesd22 b102 pdf scrap the pdf file or print jesd22 b102 pdf b102 of certificates properly when the date of expiration has passed. J-STD-002 and JESD22-B102 E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix jesd22 b102 pdf meets JESD jesd22 b102 pdf 201 class 2 whisker test Polarity: As marked Mounting Torque: 10 in-lbs maximum PRIMARY CHARACTERISTICS IF(AV) 2 x 12. Qualification Plan Device Package Process No. 245&176;C SMD & T hr oug le osin Flux (Matte tin lead finish, SnAgCu 95.

JEDEC JESD22-B102; Solderability 2 (Pb free) baking → solder dipping: 150&176;C, 16h → 245&176;C, 5seconds: JEITA ED-4701/301; JEDEC JESD22-B102; ESD Test Procedure. solderability max4906felb+ jesd22-b102, cond c (245c) 1 pass 50 0 bond pull max4906felb+ > 5 gms 1 pass 50 0 bond pull 1701 max4906felb+ > 5 gms 1 pass 50 0 convection reflow 1920 max9938felt+t 3 pass 114 0 total: 0 storage life description date condition readpoint quantity fails code test fa no vehicle pdf storage life 1917 max31889alt+t 150&176;c 10 jesd22 b102 pdf 0 storage life 1932 max31889alt+t 150&176;c. Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Mounting torque: 0.

Jesd22 b102 pdf

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